Sensata Technologies, Inc. Electronics Packaging Design Engineer in Hengelo, Netherlands
The Electronics Packaging COE is currently seeking a Packaging Design engineer to support the design and development of physical circuit layout of electronic assemblies used for sensing applications across various Sensata business units. This role interacts closely with electrical engineers, sensor design engineers and internal and supplier process engineering to develop robust electronic assembly design approaches that are cost effective, highly manufacturable while at the same time still achieving high performance and reliability goals.
Key participant in creating designs within inter-disciplinary teams to address complex product design and manufacturing challenges
Collaborates on feasibility studies and testing on new and modified designs
Organizes development testing, engineering analysis, qualification testing, production launch
Key participant in failure analysis investigations and engineering evaluations
Maintains product documentation (drawings and specifications) and lessons including; producing design reports, test reports, operating manuals and test procedures
Collaborates with senior engineers/managers to engage with customers in soliciting product specifications requirements, schedule expectations and budget
Experience / Qualifications
A university degree and 2-4 years of experience (i.e. Bachelors degree) or a graduate degree and 0-2 years of experience (i.e. Masters degree)
Must be a team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands
Strong communication skills; oral, written and presentation
Strong organization, planning and time management skills to achieve results
Strong personal and professional ethical values and integrity
Holds self-accountable to achieving goals and standards
Proficient in Microsoft Office programs (Outlook, Word, PowerPoint, and Excel)
Strong interpersonal & collaboration skills to work effectively with all levels of the organization including suppliers and/or external customers
Position Requirements/ Skills:
The candidate will be responsible for:
Designing/directing the physical layout of electrical circuits for sensing applications
Working with suppliers to realize layout into a manufacturable product
Develop robust layouts that can fit into small space envelopes required by sensing applications
Design a circuit layout that can be produced with extremely high yields on high volume production lines
Strong knowledge of DFM (design for manufacturability) is a required, and as such candidate must not only know something about circuit layout, but also have a strong knowledge of electronic assembly methods and an understanding of materials and their interactions commonly used in electronics
Education / Attributes Required:
BS or MS Degree: Materials, Chemical, Mechanical or Electrical Engineering (2-4 yrs experience)
Self-starter that can operate with limited supervision
Able to work with electrical design engineering as well as process engineering and bridge the gap from electrical concept to manufacturable product
Can identify problems and process weaknesses
Methodical problem solver that follows an organized and logical approach to problem solving
Hands on with a fundamental knowledge of electronics as well as electronic packaging and assembly processes
Excellent communicator: verbal and written (documentation of process improvements, and share with design engineers around the world)
General knowledge of manufacturing
Specific Skills/Experience (Preferred):
Knowledge of circuit layout from schematic capture to finished circuit layout
Familiarity with circuit layout tools like Mentor Graphics or Altium is a plus.
Proficiency with 2D mechanical CAD software (AutoCAD or equivalent), but Solidworks is preferred
DFM (Design For Manufacturability) experience with respect to electronic products
Knowledge of chip and wire assembly techniques
Knowledge of micro joining techniques
Knowledge of plating techniques used in electronics
Knowledge of SMT
Working knowledge of Pb free soldering and issues
Experience with traditional laminate based PCB’s , as well as thick film ceramic substrate and flex
Knowledge of encapsulation methods
Knowledge of the packaging techniques for bulk micro-machined based MEMs devices
Experience and knowledge of flipchip assembly methods
Knowledge of the various analytical techniques available to assess packaging
Knowledge of DOE and Six Sigma Methodology
Knowledge of statistics and statistical process control.
Knowledge of the automotive quality system requirements is desirable
Knowledge of the elements of an AIAG PPAP
Knowledge of best practice DFM techniques for electronic assemblies
Collaborating at Sensata means working with some of the world’s most talented people in an enriching environment that is constantly pushing towards the next best thing.
Employees work across functions, countries and cultures gaining new perspectives through mutual respect and open communication.
As OneSensata, we are working together to make things work together
NOTE: If you are a current Sensata employee (or one of our Affiliates), please back out of this application and log into Workday via the Company Intranet to apply directly. Type "FIND JOBS" in the Workday search bar.
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